Courses in Spring semester 2026
Updated 20251230
█ AISSM Core Courses
▒ BIG DATA ANALYSIS AND CLOUD COMPUTING │ Hsieh, Yu-Ming ------ One of core courses for students of AISSM
● Language: English‧In Person
● Credit: 3 Credits
● Grade: MS, PhD
This course will enable students to understand the basic theory and applications of big data analysis and cloud computing. The course content includes data preprocessing; feature selection and linear regression; classification methods such as: decision tree, association rule mining, neural networks, naïve Bayes and Bayesian belief networks, support vector machines, ensemble classifiers, clustering methods such as fuzzy c-means, mixture model clustering, self-organizing maps, grid-based clustering, subspace clustering; metaheuristics such as GA, SA, PSO and ACO; the three main types of cloud computing, such as infrastructure as a service, platform as a service and software as a service. By writing the program for actual problems, students will have the ability to solve practical industrial problems.
▒ INTRODUCTION OF SUSTAINABLE MATERIALS │ Ting, Jyh-Ming / Su, Yen-Hsun ------ One of core courses for students of AISSM
● Language: English‧In Person
● Credit: 3 Credits
● Grade: MS (Jointly offered with Dept. of Materials Science. AISSM PhD students count credits toward graduation, but enrollment is available only in Phase II.)
Sustainable development is a globally recognized mandate and includes green or environment-friendly manufacturing practices. This course highlights the fundamental processes involved in the production of renewable and sustainable materials, and the potential applications of the materials.
█ Program on Integrated Circuit Design
▒ VLSI TESTING │ Lee, Jong Kuen 
● Language: Chinese‧In Person
● Inst. Code-Serial Number: M1-005
● Credit: 3 Credits
● Grade: MS, PhD
1. Introduction / 2. Design for Testability / 3. Fault Simulation
▒ BIOMEDICAL-DOMAIN CHIP SYSTEM APPLICATION WITH AI COMPUTING │ Lee, Shun-Yuh
● Language: Chinese‧In Person (Intensive time Courses--Please note the schedule and withdrawal rules.)
● Inst. Code-Serial Number: M1-008
● Credit: 3 Credits
● Grade: MS
Part 1: Lecturing on medical knowledge and analysis techniques. Part 2: Hands-on operation of wearable devices and AI platforms. Part 3: Thematic project production for innovation and competitions.
▒ MEMORY CIRCUIT DESIGN │ Winbond Pres. Chen, Pei-Ming x Prof. Chiou, Lih-Yih (Taught by Winbond)
● Language: Chinese & English‧In Person
● Credit: 3 Credits | Grade: MS, PhD
● Prerequisite: Electronics, Electric Circuits
This course covers DRAM and Flash specifications and circuit design, and the use of circuits to aid testing and manufacturing.
█ Program On Semiconductor Manufacturing Technology
▒ INTRODUCTION TO SOI SUBSTRATES │ Cheng, Chiao-Yang
● Language: Chinese | Credit: 3 | Grade: MS, PhD
This course introduces the fundamental principles, fabrication methods, and development of SOI technology in current semiconductor devices.
█ Program on Smart and Sustainable Manufacturing
▒ INTEGRATED 3D NANO AND MICRO FABRICATION │ JUN MIZUNO
● Language: English‧In Person
● Credit: 3 | Grade: MS, PhD
Introduces Integrated Nano and micro fabrication based MEMS processes. Grading based on presentation (100%).