NCKU-AISSM NEWS

Courses in Fall semester 2026

█ AISSM

▒ INTRODUCTION AND PRACTICES OF ARTIFICIAL INTELLIGENCE │ Hsieh,Yu-Ming - Assistant Professor------One of core courses for students of AISSM

Chinese‧Core Competency‧In Person

Credit：3

This course introduces students to machine learning, deep learning and reinforcement learning theory. Topics covered include various supporting programming languages, development tools, time series forecasting, object detection, and artificial intelligence applications.

▒ INTRODUCTION OF SUSTAINABLE ENERGY │ Lin,  Shih-kang - Professor 、Yu, Sheng-Sheng - Associate Professor、Wu, Wei - Professor------Invite Industry teachers /One of core courses for students of AISSM

Chinese‧Core Competency‧In Person

Credit：3

1.Cultivate qualified personnel with communication and management skills for sustainable industries.

2. Understand industrial development, multidisciplinary integration and global vision through research and project implementation.

3. Cooperate theory and practice to solve engineering challenges in sustainable development and intelligent manufacturing.

█ Program on Integrated Circuit Design

▒ FUNDAMENTALS OF DIGITAL IC DESIGN(Ｉ) │ Kuo, Chih-Hung - Associate Professor----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

Fundamental concepts for the design of digital logic circuits：

Introduction/ Boolean algebra/ Applications of Boolean algebra/ From Boolean to circuits/ Design of combinational circuits/ Multiplexers and decoders/ Registers and counters/ Analysis of sequential circuits/ Design of sequential circuits

▒ DIGITAL IC DESIGN AND SYNTHESIS │ Chiou, Lih-Yih - Professor----Summer School

English‧Summer School.In Person

Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD6350.(The course is full.)

Credit：3

The next-generation electronic system will have billions of transistors on a chip. To design such a complex system, designers must understand IC design issues and EDA tool principles to cope with this daunting task. The course targets senior undergraduate or fresh graduate students to provide adequate background for designing a moderate-size system and emphasizes the balance between theory and hands-on. Upon completing this course, you shall have a. This course will teach you 1) VLSI system design flow, 2) primary EDA tools, and 3) moderate-size HDL coding.

Course info：https://2026sss.ais2m.ncku.edu.tw/

▒ ANALOG INTEGRATED CIRCUIT DESIGN AND LAYOUT │ Lee, Shun-Yuh - Professor----Summer School

English‧Summer School.In Person

Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD6350. (The course is full.)

Credit：3

The main goal of the course is to introduce analog integrated circuits and operational amplifier integrated circuit design as the basis for the design of analog signal processing systems. In addition, through operational amplifier circuit simulation and layout practice, engineers who are interested in learning analog integrated circuit design can quickly familiar with operational amplifier design techniques and application scenarios (such as switched capacitor integrated circuits), the students can extend their knowledge to the design of analog filters and analog-to-digital converters in the future. Its goals are as follows: 1. The characteristics of operational amplifier integrated circuits learning 2. Familiar with operational amplifier integrated circuit design techniques 3. Op amp circuit behavior simulation 4. Operational amplifier layout training.

Course info：https://2026sss.ais2m.ncku.edu.tw/

▒ SPECIAL TOPIC ON ANALOG AND MIXED-SIGNAL IC DESIGN AND REALIZATION (2) │ Huang, Tzuen-Hsi - Professor

English‧In Person---For exchange students of this program only.Contact the program office for enrollment.

Credit：3

This course is a graduate-level offering focusing on the complete lifecycle of integrated circuits, including power management, mixed-signal, or radio-frequency circuits and systems. This course emphasizes the unique challenges of continuous-time circuit behavior, noise, matching, and layout effects. Students will engage in a major project involving the design, simulation, and physical layout of a complex power management, mixed-signal or radio-frequency circuit blocks, such as a regulator, a power converter, an analog filter, a data converter (ADC/DAC), a wireless/wireline radio-frequency analog front-end circuit, a Phase-Locked Loop (PLL), or related circuits and systems.

▒ SPECIAL TOPIC ON DIGITAL IC DESIGN AND REALIZATION (2) │ Kuo, Chih-Hung - Associate Professor

English‧In Person---For exchange students of this program only.Contact the program office for enrollment.

Credit：3

This course is a graduate-level capstone or special topics course focused on the complete design and realization of a complex Digital Integrated Circuit (IC). This course offers hands-on experience in the full Digital IC design flow, from high-level specification to Tape-Out. Students master RTL coding and verification, then utilize EDA tools for synthesis and physical layout. The goal is to achieve timing closure and to prepare a final, manufacturable design (GDSII) that meets industrial standards.

█ Program On Semiconductor Manufacturing Technology

▒ ADVANCED SEMICONDUCTOR MANUFACTURING AND PACKAGING TESTING TECHNOLOGY  │ Tu, Wei-Chen - Professor----Summer School

English‧Simmer school‧In Person

Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD6350. (The course is full.)

Credit：3

This course aims to provide students with an in-depth understanding of advanced semiconductor manufacturing and packaging testing technologies. Topics covered include semiconductor fabrication, packaging technologies, photolithography and patterning, numerical simulation applications, and advanced 3D high-density integration (3DHI) trends. The course also integrates industry practices and research institute visits to help students stay updated on the latest advancements in the semiconductor industry.

Course info：https://2026sss.ais2m.ncku.edu.tw/

▒ SEMICONDUCTOR KEY TECHNOLOGIES AND LEADERSHIP PRACTICE │ Winbond / Pai, Pei-Lin - CTO---Taught by Winbond

Chinese‧Winbond X NCKU‧In Person

Credit：3

In this course, you can learn the basic concepts to understand the fundamentals of semiconductor key technologies. Meanwhile, you will learn useful soft skills including effective communication, the skills of problem analyzing and solving, etc. The course would strengthen your various skills and help you apply what you’ve learned to the research or future work.

▒ FUNDAMENTALS AND INDUSTRY APPLICATIONS OF SEMICONDUCTOR MANUFACTURING TECHNOLOGIES │ Lam Research / Kuo, William - CTO---Taught by Lam Research

Chinese‧In Person

Credit：0.5

Core Principles and Industrial Applications of Plasma Etching, Thin-Film Technologies, and Wet Processes in Semiconductor Manufacturing This course provides an industry oriented and systematic introduction to three essential technology domains in semiconductor manufacturing: plasma etching, thin film deposition, and wet etching & chemical cleaning. Integrating process physics, equipment engineering, materials science, and real manufacturing challenges, the course explores fundamental mechanisms, equipment design logic, practical applications, and future technological trends. Plasma Etching (Dry Etch) Plasma etching is one of the most critical technologies in modern semiconductor fabrication, widely used for lithographic pattern transfer, high aspect ratio structure formation, and surface modification or cleaning.

This module helps students understand how plasma based processes enable nanometer scale precision and support continuous device scaling. Wet Etching and Chemical Cleaning (Wet Etch & Cleaning) Wet processes are indispensable in semiconductor manufacturing, encompassing both wet etching and chemical cleaning.

This module provides a systematic introduction to reaction mechanisms, material behavior, and process integration considerations. Students will learn how wet processes maintain surface quality and cleanliness, which are essential for advanced device fabrication and overall process stability. Thin-Film Deposition Technologies (Thin Film Deposition)

This module offers an in depth examination of dielectric and metal thin film deposition technologies extensively used in the semiconductor industry. Covering materials, equipment, and processes, the course introduces major deposition methods such as PVD, CVD, and ALD, along with their fundamental principles, reaction mechanisms, and material characteristics.

The discussion extends to typical chamber architectures and equipment design considerations, enabling students to understand thin film processes from both “process science” and “equipment engineering” perspectives.

The module also highlights common applications of thin films in semiconductor manufacturing, including FEOL device fabrication, dielectric layer stacking, metal interconnects, and process integration requirements. Through case studies, students will understand how thin film properties influence device performance, reliability, and yield.

▒ FUNDAMENTALS OF NANOELECTRONICS │ Shyamal Kumar Saha - Professor

English‧In Person

Credit：3

The key feature of the modern electronics is the continuing miniaturization of the transistor size. Does the existing knowledge of electronic properties (current flow, electrical resistance, electrostatics of the nano-contacts of the source, drain and gate electrodes in a transistor) applicable to these nano (quantum) devices or we have to develop something new? In this course, we will discuss what really happens to the electronic properties of a transistor if the channel length goes down to 1nm. The students will learn in this course, the new understanding of the electronic properties (current flow, electrical resistance, density of states, contact resistance of the electrodes etc.) of the devices when the channel length of a transistor becomes really few atoms or molecules and how to reach the bulk electronic properties starting from small one (bottom-up approach).

▒ SIC SEMICONDUCTOR PROCESS AND APPLICATION│ Chang, Chiao-Yang - Associate Professor

Chinese‧In Person

Credit：3

Silicon carbide components have the characteristics that the current silicon -based elements cannot replace. This course first introduces the essence of silicon carbide crystals, extending to the key manufacturing process of wafers and chips.

▒ OPTICAL ANALYSIS OF NANO-SURFACES AND INTERFACES│  Lo, Kuang-Yao - Professor

Chinese‧In Person

Credit：3

Analysis of thin-film structure quality and defects in advanced semiconductor manufacturing processes is a crucial factor in improving process yield, optical analysis is a non-destructive testing method. It overcomes the limitations of TEM, which is limited to the tens of nanometer scale, and can reveal the physical properties of surfaces and interfaces. In particular, nonlinear optics offers the ability to analyze symmetrical structures, compositions, defects, and post-processing structural changes. This course will first introduce the structures of semiconductor thin films and two-dimensional materials, then explain the physical principles of nonlinear optics, Raman and fluorescence spectroscopy, and use practical examples to illustrate how optical analysis is applied to the analysis of semiconductor thin-film structures and novel two-dimensional materials.

▒ INTRODUCTION TO SEMICONDUCTOR MANUFACTURING TECHNOLOGY AND ITS MONITORING/MANAGEMENT│  UMC / Wen, Ching-Chang - Former General Manager (Industry Expert)

Chinese‧In Person

Credit：3

Analysis of thin-film structure quality and defects in advanced semiconductor manufacturing processes is a crucial factor in improving process yield, optical analysis is a non-destructive testing method. It overcomes the limitations of TEM, which is limited to the tens of nanometer scale, and can reveal the physical properties of surfaces and interfaces. In particular, nonlinear optics offers the ability to analyze symmetrical structures, compositions, defects, and post-processing structural changes. This course will first introduce the structures of semiconductor thin films and two-dimensional materials, then explain the physical principles of nonlinear optics, Raman and fluorescence spectroscopy, and use practical examples to illustrate how optical analysis is applied to the analysis of semiconductor thin-film structures and novel two-dimensional materials.

▒ QUALITY MANAGEMENT AND ADVANCED PROCESS CONTROL IN SEMICONDUCTOR MANUFACTURING│  Winbond / Tsai, Jin-Feng - Former Vice President (Industry Expert)

English‧In Person

Credit：3

This course provides a path to learn quality management and advanced process control for graduate students who will work in the semiconductor industry in the future. Based on quality management systems and semiconductor industry requirements of product quality, learners can understand the strict and critical process control nodes in the semiconductor process, including material selection and measurement system analysis (MSA), and how to implement advanced process control (APC). We will discuss them with practical examples of run-to-run (R2R) control in wafer fabs. Through implementation of virtual metrology (VM), AI applications, and continuous improvement task (CIT), the ultimate goal is to manufacture high-quality and reliable semiconductor devices. The knowledge deepens the professional skills of quality and process in semiconductor manufacturing for leaners, which is very helpful for the work of process, quality, product, and design engineers.

█  Program on Semiconductor Packaging and Testing

▒ ADVANCED PACKAGING TECHNOLOGY AND APPLICATIONS │ AzTrong / Ho, Kwun-Yao - CTO (Industry Expert)

English‧In Person

Credit：1

This course provides a comprehensive introduction to advanced semiconductor packaging technologies for AI, High-Performance Computing (HPC), and next-generation heterogeneous systems. Topics include advanced packaging evolution from flip-chip to 2.5D and 3D integration, CoWoS, SoIC, EMIB, CoPoS, CoWoP, chiplet architecture, HBM integration, TSV technology, hybrid bonding, packaging substrates, signal integrity, power integrity, thermal management, reliability, and AI-driven smart manufacturing. The course further explores system-level design challenges including AI server architecture, memory hierarchy, runtime memory orchestration, packaging-aware system optimization, and future trends such as co-packaged optics and AI infrastructure platforms. Students will develop both technical knowledge and system-level perspectives through industry case studies and project-based discussions.

▒ FIRST PRINCIPLES CALCULATION OF SEMICONDUCTOR AND OPTO-ELECTRONIC MATERIALS : FUNDAMENTALS  │ Lee, Ming-Hsien - Ajunct Professor(Physics Professor at Tamkang University)----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

This fundamental course uses the most advanced theories and software available teach computational materials science. Graphical user interface with powerful atomistic model building, 3D visualization allow quick access to materials design tasks. Many kinds of physical properties can be analyzed. This course help students to bring closer the gap between fundamental physics and modern industrial applications.

█  Program on Key Materials

▒ GROWTH OF OPTOELECTRONIC CRYSTAL │ Chou, Mitch - Chair Professor

English‧In Person

Credit：3

”Growth of Optoelectronic Crystal” is designed for materials science and physics students who aspire to work in the fields of crystal growth, optical and laser materials, and electro-optic devices. The course will cover the fundamental theories of crystal growth, various growth techniques such as vapor deposition, solution growth, and melt growth, and how to control and optimize crystal quality in the lab. Students will learn to assess defects within crystals and understand how these defects affect material performance. Additionally, the course explores the practical applications of different types of crystals, including their use in optical devices, laser technology, and electro-optic components. Through this learning experience, students will acquire valuable knowledge and skills to prepare for careers in these related fields.

▒ OPTICAL PROPERTIES OF SOLIDS │ Lee, Ya-Ju- Professor

English‧In Person

Credit：3

This course introduces the fundamental principles of light-matter interactions in solids, covering optical phenomena such as propagation, absorption, emission, and scattering, and their connection to microscopic mechanisms including band structure, excitons, phonons, and free carriers in semiconductors. Topics include linear and nonlinear optics, quantum-confined structures (e.g., quantum wells and quantum dots), and modern optoelectronic materials and devices

▒ WIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES │ Kuo, Cheng Huang- Professor

Chinese‧In Person

Credit：3

This course covers an introduction to wide-bandgap semiconductor materials (GaN, SiC, Ga₂O₃), single-crystal substrates, epitaxial growth, principles of CVD, and device design and fabrication.

▒ SINGLE CRYSTAL GROWTH OF INTERMETALLIC COMPOUNDS: TECHNIQUES AND PRACTICES │ Kuo, Chia-Nung- Associate Professor

English‧In Person

Credit：3

High-quality single crystals have a profound impact on both fundamental scientific research and technological applications. Depending on the physical properties and chemical compositions of materials, appropriate crystal growth techniques must be selected. This course begins with an introduction to the principles of crystal growth, binary and multicomponent phase diagrams, as well as various laboratory crystal growth methods and techniques. The second part of the course focuses on crystal quality characterization, including powder X-ray diffraction (pXRD), Laue diffraction, and related techniques. The practical component provides hands-on experience with several crystal growth methods, such as slow evaporation, melt growth, flux growth, and vapor transport.

▒ NANOMATERIAL SYNTHESIS AND TECHNIQUES │ Hsu, Su-Wen - Associate Professor ----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

Nanomaterials Science and technology is concerned with the design, fabrication and application of nanostructures or nanomaterials, and the fundamental understanding of the relationships between physical properties or phenomena and material dimensions. It deals with materials or structures in nanometers and is a new field or a new scientific domain. Similar to quantum mechanics, on nanometer scale, materials or structures may possess new physical properties or exhibit new physical phenomena. Nanomaterials have an extremely broad range of potential applications from nanoscale electronics and optics, to nanobiological systems and nanomedicine. This course will cover the following topics:1.intoruction 2.characuerization of nanomaterials 3.charateristics of nanomaterials 4.surface chemistry of nanomaterials 5.synthesis of nanomaterials 6.application nanomaterials.

 █ Program on Smart and Sustainable Manufacturing

▒ APPLIED NANO / MICRO DEVICE SCIENCE │ JUN MIZUNO - Professor

English‧In Person

Credit：3

This course introduces advanced Nano/Micro-devices based microelectromechanical systems (MEMS) processes. At the end of this course, students will be able to propose novel functional Nano/Micro-devices and acquire skills in preparing a research proposal and making oral presentation through group work. Students will be expected to spend four hours on preparing and reviewing each class. Grading will be decided based on short report (50%) and presentation (50%). To pass this course, students must earn at least 60 points out of 100.

▒ INTELLIGENT ENERGY MANAGEMENT SYSTEM │ Ou, ting-chia - Assistant Professor

Chinese‧In Person

Credit：3

After the gradual global warming, extreme climates such as catastrophic rainstorms, century-old droughts, deadly heat waves and high temperatures, and forest fires are common to the natural ecological environment. The issue of carbon reduction has once again received attention from various countries. The EU passed legislation to combat climate change on 2022/06/22, including reducing the use of chemical pesticides by 50% by 2030, ending carbon trading subsidies for steel and other industries early, and expanding the scope of applicable products for carbon border taxes. According to the Carbon Border Adjustment Mechanism (CBAM) amendment plan, the EU carbon trading system will be extended to the maritime industry. Starting from 2027, 100% of all maritime carbon emissions entering and leaving the EU and within the EU will be included in carbon trading; in addition, In addition to carbon dioxide emissions, the European Parliament has also called for other greenhouse gases such as methane to be included in a price mechanism and included in the carbon trading system. The technology development in the face of net zero, carbon neutrality and negative carbon emissions in the world cannot be delayed. my country also declared that "2050 net-zero transition is the goal of the world and also Taiwan's goal." Taiwan will, like most countries in the world, pragmatically plan the transition path towards net-zero emissions by 2050. This course integrates the energy management system with the needs and development of carbon management in the industry. The energy management system based on the Internet of Things allows renewable energy and energy storage technology to collect power generation data in real time, with real-time power measurement technology, Internet of Things technology, and data analysis technology. The advantage even predicts renewable energy generation; at the same time implements future net-zero emission targets including carbon disclosure (carbon inventory and carbon footprint calculation), carbon reduction and carbon neutrality.

▒ INTELLIGENT ENERGY MANAGEMENT SYSTEM │ Ou, ting-chia - Assistant Professor

Chinese‧In Person

Credit：3

This course introduces green energy technology and carbon-negative technology into ESG sustainable development and CSR corporate social responsibility, while integrating the low-carbon needs and development plans of the industry. It uses green energy to combine energy-saving and carbon-reducing technology with carbon-negative technology for carbon-fixing biological automated breeding. Achieve carbon neutrality with carbon rights trading; implement corporate ESG sustainable development and accelerate net-zero goals.

▒ DIGITAL TWIN AND IC PACKAGING │ Yu, Chi-Hua -Associate Professor---Invite Industry teachers

English‧In Person

Credit：3

This comprehensive 18-week course aims to provide participants with essential knowledge and practical skills in IC packaging technology, the concept of digital twins, and artificial intelligence (AI) applications within semiconductor manufacturing processes. IC packaging is a critical phase in semiconductor production, significantly impacting device performance, reliability, and miniaturization. Advanced packaging solutions enable the integration of heterogeneous components and support the development of next-generation electronic devices, including those used in 5G, high-performance computing (HPC), and artificial intelligence of things (AIoT). The concept of digital twins, which involves creating virtual replicas of physical entities, processes, or systems, provides powerful tools for predictive analytics, real-time monitoring, and lifecycle management in IC packaging. Incorporating digital twins into the semiconductor industry can substantially improve efficiency, reduce costs, and minimize risks associated with complex manufacturing processes. AI further enhances semiconductor manufacturing through sophisticated algorithms capable of analyzing vast data sets for process optimization, predictive maintenance, defect detection, and yield improvement. Integrating AI methodologies with digital twin technology empowers more accurate predictive modeling, deeper insights into manufacturing processes, and advanced decision-making capabilities. In the second half of the course, participants gain hands-on experiences using Moldex3D software, a state-of-the-art simulation tool for IC packaging. Participants will engage in practical exercises, detailed case studies, and projects that integrate Moldex3D simulations with digital twin concepts and AI-driven optimization techniques. The course culminates with participants presenting their final projects, demonstrating their mastery of advanced IC packaging simulation and innovative application of digital technologies.

▒ FIRST PRINCIPLES CALCULATION OF SEMICONDUCTOR AND OPTO-ELECTRONIC MATERIALS ：APPLICATIONS   │ Lee, Ming-Hsien - Ajunct Professor(Physics Professor at Tamkang University)----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

This application course uses the most advanced theories and software available teach computational materials science. Graphical user interface with powerful atomistic model building, 3D visualization allow quick access to materials design tasks. Many kinds of physical properties can be analyzed. This course help students to bring closer the gap between fundamental physics and modern industrial applications.