Courses in Fall semester 2025

█ AISSM

▒ INTRODUCTION AND PRACTICES OF ARTIFICIAL INTELLIGENCE │ Hsieh,Yu-Ming - Assistant Professorr------One of core courses for students of AISSM

Chinese‧Core Competency‧In Person

Credit：3

This course introduces students to machine learning, deep learning and reinforcement learning theory. Topics covered include various supporting programming languages, development tools, time series forecasting, object detection, and artificial intelligence applications.

▒ INTRODUCTION OF SUSTAINABLE ENERGY │ Lin,  Shih-kang - Professor 、Yu, Sheng-Sheng - Associate Professor------Invite Industry teachers /One of core courses for students of AISSM

Chinese‧Core Competency‧In Person

Credit：3

1.Cultivate qualified personnel with communication and management skills for sustainable industries.

2. Understand industrial development, multidisciplinary integration and global vision through research and project implementation.

3. Cooperate theory and practice to solve engineering challenges in sustainable development and intelligent manufacturing.

█ Program on Integrated Circuit Design

▒ DIGITAL IC DESIGN AND SYNTHESIS │ Chiou, Lih-Yih - Professor----Summer School

English‧Summer School.In Person---Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD5000.(The course is full.)

Credit：3

The next-generation electronic system will have billions of transistors on a chip. To design such a complex system, designers must understand IC design issues and EDA tool principles to cope with this daunting task. The course targets senior undergraduate or fresh graduate students to provide adequate background for designing a moderate-size system and emphasizes the balance between theory and hands-on. Upon completing this course, you shall have a. This course will teach you 1) VLSI system design flow, 2) primary EDA tools, and 3) moderate-size HDL coding.

Course info：https://2025sss.ais2m.ncku.edu.tw/

▒ ANALOG INTEGRATED CIRCUIT DESIGN AND LAYOUT │ Lee, Shun-Yuh - Professor----Summer School

English‧Summer School.In Person

Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD5000.

(Limited slots available / Please contact kacieliu@gs.ncku.edu.tw to inquire about availability.)

Credit：3

The main goal of the course is to introduce analog integrated circuits and operational amplifier integrated circuit design as the basis for the design of analog signal processing systems. In addition, through operational amplifier circuit simulation and layout practice, engineers who are interested in learning analog integrated circuit design can quickly familiar with operational amplifier design techniques and application scenarios (such as switched capacitor integrated circuits), the students can extend their knowledge to the design of analog filters and analog-to-digital converters in the future. Its goals are as follows: 1. The characteristics of operational amplifier integrated circuits learning 2. Familiar with operational amplifier integrated circuit design techniques 3. Op amp circuit behavior simulation 4. Operational amplifier layout training.

Course info：https://2025sss.ais2m.ncku.edu.tw/

▒ SPECIAL STUDY ON DISPLAY DRIVER CIRCUIT DESIGN │ Lu, Chih-Wen - Professor------English taught

English‧In Person

Credit：3

This course will provide a comprehensive introduction from LCD, OLED, Mini/Micro LED display architecture, driving principles, driving circuit design to driving circuit examples. The course content includes an introduction to LCD, OLED, Mini/Micro LED display architecture, driving principles and driving circuits, and analyzes the differences between several display driving circuits. In addition, this course will discuss the design of LCD, OLED, Mini/Micro LED display drive circuits with examples, so that students who are interested in flat panel display drive principles, systems, and IC design can learn about LCD, OLED, Mini/Micro Have a comprehensive understanding of LED display driving principles and related circuit design. This course has special topics.

▒ FUNDAMENTALS OF DIGITAL IC DESIGN(Ｉ) │ Kuo, Chih-Hung - Associate Professor----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

Fundamental concepts for the design of digital logic circuits：

Introduction/ Boolean algebra/ Applications of Boolean algebra/ From Boolean to circuits/ Design of combinational circuits/ Multiplexers and decoders/ Registers and counters/ Analysis of sequential circuits/ Design of sequential circuits

█ Program On Semiconductor Manufacturing Technology

▒ THE ESSENTIALS OF SEMICONDUCTOR TECHNOLOGY AND SUPPLY CHAINS │ Tu, Wei-Chen - Associate Professor----Summer School

English‧Simmer school‧In Person

Enrolled students need to participate in the summer school to finish the course and therefore need to pay an application fee of NTD5000. (The course is full.)

Credit：3

This course aims to provide students with an in-depth understanding of advanced semiconductor manufacturing and packaging testing technologies. Topics covered include semiconductor fabrication, packaging technologies, photolithography and patterning, numerical simulation applications, and advanced 3D high-density integration (3DHI) trends. The course also integrates industry practices and research institute visits to help students stay updated on the latest advancements in the semiconductor industry.

▒ SEMICONDUCTOR KEY TECHNOLOGIES AND LEADERSHIP PRACTICE │ Winbond / Pai, Pei-Lin - CTO---Taught by Winbond

Chinese‧Winbond X NCKU‧In Person

Credit：3

In this course, you can learn the basic concepts to understand the fundamentals of semiconductor key technologies. Meanwhile, you will learn useful soft skills including effective communication, the skills of problem analyzing and solving, etc. The course would strengthen your various skills and help you apply what you’ve learned to the research or future work.

▒ PRINCIPLES AND APPLICATIONS OF SEMICONDUCTOR PROCESS TECHNOLOGY │ Lam Research / Kuo, William - CTO---Taught by Lam Research

Chinese‧In Person

Credit：0.5

This course will introduce the fundamentals and applications of Plasma Etching, Film Deposition & Wafer Wet Clean from the perspective of the industry: Introduction of Plasma Dry Etch Plasma etching processes hold a crucial position in semiconductor manufacturing. They are primarily applied in the photolithography pattern transfer, high aspect ratio structure fabrication, and surface modification/cleaning during wafer production. Plasma etching enables nanometer-scale precision processing, which is essential for the miniaturization of modern semiconductor devices. Accurate plasma etching process control techniques are vital for enhancing device performance and yield. This course will introduce the following topics from an industry perspective including 1. Fundamental concepts of plasma etching, 2. Etching profile control, 3. Plasma etching uniformity control, 4. Plasma etching consistency control. Introduction of Film Deposition Dielectric and metal films are the foundations of IC manufacturing. Proper film type selection can greatly influence the device performance, device density, power consumption, and cost. Deposition techniques are aiming to deposited target materials not only with good control at extremely small scales, typically nanometer or even angstrom level, but also with good electrical/physical properties and productivity to meet advance IC chip needs. This course is to introduce some dielectric/metal deposition techniques that are widely used in semiconductor industry, including PECVD, ALD, thermal metal CVD and Cu plating. The course will discuss the deposition techniques from the perspectives of basic mechanism, basic chamber design, and typical applications in semiconductor manufacturing flow. The course will discuss the major development roadmap in the industry, the challenges, and potential solutions. Introduction of Wet Etch and Clean The wet process is crucial in semiconductor manufacturing, primarily used in wet etching and chemical cleaning during wafer IC fabrication. Wet etching precisely removes material from specific wafer areas, while chemical cleaning eliminates contaminants like particles, metal impurities, organic substances, surface micro-roughness, and oxide layers. This ensures process stability and high product quality. Precise control techniques are essential to maintain product quality and improve process consistency and yield. This course covers the surface chemistry and physics involved in semiconductor wet cleaning, etching, and surface conditioning processes. This course will go through basic chemistry for 1. wet cleaning and etching, 2. surface phenomena during the process, 3. rinsing and drying of cleaned wafers, and 4. particle and contamination removal.

▒ ELECTRONS AND PHOTONS IN MICROSCOPIC WORLD │Academia Sinica /Lin, Shih-Yen - Researcher(Adjunct Professor)

Chinese‧In Person

Credit：2

The lecture is given by different research fellows from the Research Center of Applied Sciences, Academia Sinica. The purpose is to give a more clear picture to the students in this lecture about the research directions at RCAS. The contents would include 2D material growth and their device applications, first-principal calculation of semiconductors, the world of nano-photonics, the future of quantum photonics and quantum technologies, synthesis and application of quantum dots and energy materials and the introduction of photonic crystals. In this lecture, we will also try to invite HR divisions from different companies to give the students briefings on their companies. We hope that the attendees of this lecture can have more understanding on the world outside universities.

▒ FUNDAMENTALS OF NANOELECTRONICS │ Shyamal Kumar Saha - Professor------English taught

English‧In Person

Credit：3

The key feature of the modern electronics is the continuing miniaturization of the transistor size. Does the existing knowledge of electronic properties (current flow, electrical resistance, electrostatics of the nano-contacts of the source, drain and gate electrodes in a transistor) applicable to these nano (quantum) devices or we have to develop something new? In this course, we will discuss what really happens to the electronic properties of a transistor if the channel length goes down to 1nm. The students will learn in this course, the new understanding of the electronic properties (current flow, electrical resistance, density of states, contact resistance of the electrodes etc.) of the devices when the channel length of a transistor becomes really few atoms or molecules and how to reach the bulk electronic properties starting from small one (bottom-up approach).

▒ SIC SEMICONDUCTOR PROCESS AND APPLICATION│ Chang, Chiao-Yang - Associate Professor

Chinese‧In Person

Credit：3

Silicon carbide components have the characteristics that the current silicon -based elements cannot replace. This course first introduces the essence of silicon carbide crystals, extending to the key manufacturing process of wafers and chips.

█  Program on Semiconductor Packaging and Testing

▒ ADVANCED PACKAGING SYSTEM │ Hwang, Sheng-Jye - Distinguished Professor---Co-taught with TSMC 

Chinese‧In Person

Credit：1

This course is intended to let the students understand the main advanced packaging technologies and their applications. This course will also demonstrate the basic core values and technology trends of advanced IC Packaging system.

TSMC is involved in course instruction. Students enrolling in the course are required to register for the TSMC Semiconductor Program. Saturday classes will take place at the TSMC Training Center in Taichung for hands-on practice.

▒ DRAM DESIGN, PROCESS AND APPLICATION  │ Lo, Yu-Lung -  Chair Professor---Taught by Micron 

Chinese‧In Person

Credit：1

With the application of 5G, artificial intelligence, cloud computing, smart healthcare, and digital transformation, they need not only memory configuration but also memory speed and power performance, which are linked to the competitiveness of the products developed. This course is taught by Micron Technology, the world's third largest memory company on DRAM memory technology from an industry perspective. This course's objective is to help students further integrate what they have learned with relevant research and industry. This course provides a comprehensive overview, covering various aspects related to DRAM. By taking this course, students gain insights into DRAM technology, industry trends, challenges, and the strategic value of memory R&D and manufacturing in Taiwan.

▒ FIRST PRINCIPLES CALCULATION OF SEMICONDUCTOR AND OPTO-ELECTRONIC MATERIALS : FUNDAMENTALS  │ Lee, Ming-Hsien - Ajunct Professor(Physics Professor at Tamkang University)----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

This fundamental course uses the most advanced theories and software available teach computational materials science. Graphical user interface with powerful atomistic model building, 3D visualization allow quick access to materials design tasks. Many kinds of physical properties can be analyzed. This course help students to bring closer the gap between fundamental physics and modern industrial applications.

█  Program on Key Materials

▒ Growth of Optoelectronic Crystal │ Chou, Mitch - Chair Professor------English taught

English‧In Person

Credit：3

“Growth of Optoelectronic Crystal” is intended for a material science and physics student who wish to pursue a profession in the crystal growth, optical and laser materials, and electro-optics devices field. This course will cover the crystal growth theory, defect evaluation and the applications of the different kinds of crystals.

▒ Wide Bandgap Semiconductor Materials and Devices │ Lee, Ya-Ju- Professor------English taught

English‧In Person

Credit：3

This course mainly deals with the physical properties and designed concepts for wide bandgap semiconductors. It will start from classical description on their optical characteristics, followed by simple quantum description on absorption and emission of photons, and apply such fundamentals to various optoelectronic devices, particularly for those fabricated by wide bandgap semiconductors. The basic operation principles of power devices, detectors, light-emitting diodes, laser diodes and etc., will also be introduced in this course.

▒ NANOMATERIAL SYNTHESIS AND TECHNIQUES │ Hsu, Su-Wen - Associate Professor ----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

Nanomaterials Science and technology is concerned with the design, fabrication and application of nanostructures or nanomaterials, and the fundamental understanding of the relationships between physical properties or phenomena and material dimensions. It deals with materials or structures in nanometers and is a new field or a new scientific domain. Similar to quantum mechanics, on nanometer scale, materials or structures may possess new physical properties or exhibit new physical phenomena. Nanomaterials have an extremely broad range of potential applications from nanoscale electronics and optics, to nanobiological systems and nanomedicine. This course will cover the following topics:1.intoruction 2.characuerization of nanomaterials 3.charateristics of nanomaterials 4.surface chemistry of nanomaterials 5.synthesis of nanomaterials 6.application nanomaterials.

 █ Program on Smart and Sustainable Manufacturing

▒ APPLIED NANO / MICRO DEVICE SCIENCE │ JUN MIZUNO - Professor------English taught

English‧In Person

Credit：3

This course introduces advanced Nano/Micro-devices based microelectromechanical systems (MEMS) processes. At the end of this course, students will be able to propose novel functional Nano/Micro-devices and acquire skills in preparing a research proposal and making oral presentation through group work. Students will be expected to spend four hours on preparing and reviewing each class. Grading will be decided based on short report (50%) and presentation (50%). To pass this course, students must earn at least 60 points out of 100.

▒ INTELLIGENT ENERGY MANAGEMENT SYSTEM │ Ou, ting-chia - Assistant Professor

Chinese‧In Person

Credit：3

After the gradual global warming, extreme climates such as catastrophic rainstorms, century-old droughts, deadly heat waves and high temperatures, and forest fires are common to the natural ecological environment. The issue of carbon reduction has once again received attention from various countries. The EU passed legislation to combat climate change on 2022/06/22, including reducing the use of chemical pesticides by 50% by 2030, ending carbon trading subsidies for steel and other industries early, and expanding the scope of applicable products for carbon border taxes. According to the Carbon Border Adjustment Mechanism (CBAM) amendment plan, the EU carbon trading system will be extended to the maritime industry. Starting from 2027, 100% of all maritime carbon emissions entering and leaving the EU and within the EU will be included in carbon trading; in addition, In addition to carbon dioxide emissions, the European Parliament has also called for other greenhouse gases such as methane to be included in a price mechanism and included in the carbon trading system. The technology development in the face of net zero, carbon neutrality and negative carbon emissions in the world cannot be delayed. my country also declared that "2050 net-zero transition is the goal of the world and also Taiwan's goal." Taiwan will, like most countries in the world, pragmatically plan the transition path towards net-zero emissions by 2050. This course integrates the energy management system with the needs and development of carbon management in the industry. The energy management system based on the Internet of Things allows renewable energy and energy storage technology to collect power generation data in real time, with real-time power measurement technology, Internet of Things technology, and data analysis technology. The advantage even predicts renewable energy generation; at the same time implements future net-zero emission targets including carbon disclosure (carbon inventory and carbon footprint calculation), carbon reduction and carbon neutrality.

▒ INTELLIGENT ENERGY MANAGEMENT SYSTEM │ Ou, ting-chia - Assistant Professor

Chinese‧In Person

Credit：3

This course introduces green energy technology and carbon-negative technology into ESG sustainable development and CSR corporate social responsibility, while integrating the low-carbon needs and development plans of the industry. It uses green energy to combine energy-saving and carbon-reducing technology with carbon-negative technology for carbon-fixing biological automated breeding. Achieve carbon neutrality with carbon rights trading; implement corporate ESG sustainable development and accelerate net-zero goals.

▒ DIGITAL TWIN AND IC PACKAGING │ Yu, Chi-Hua -Associate Professor----English taught

English‧In Person

Credit：3

This comprehensive 18-week course aims to provide participants with essential knowledge and practical skills in IC packaging technology, the concept of digital twins, and artificial intelligence (AI) applications within semiconductor manufacturing processes. IC packaging is a critical phase in semiconductor production, significantly impacting device performance, reliability, and miniaturization. Advanced packaging solutions enable the integration of heterogeneous components and support the development of next-generation electronic devices, including those used in 5G, high-performance computing (HPC), and artificial intelligence of things (AIoT). The concept of digital twins, which involves creating virtual replicas of physical entities, processes, or systems, provides powerful tools for predictive analytics, real-time monitoring, and lifecycle management in IC packaging. Incorporating digital twins into the semiconductor industry can substantially improve efficiency, reduce costs, and minimize risks associated with complex manufacturing processes. AI further enhances semiconductor manufacturing through sophisticated algorithms capable of analyzing vast data sets for process optimization, predictive maintenance, defect detection, and yield improvement. Integrating AI methodologies with digital twin technology empowers more accurate predictive modeling, deeper insights into manufacturing processes, and advanced decision-making capabilities. In the second half of the course, participants gain hands-on experiences using Moldex3D software, a state-of-the-art simulation tool for IC packaging. Participants will engage in practical exercises, detailed case studies, and projects that integrate Moldex3D simulations with digital twin concepts and AI-driven optimization techniques. The course culminates with participants presenting their final projects, demonstrating their mastery of advanced IC packaging simulation and innovative application of digital technologies.

▒ FIRST PRINCIPLES CALCULATION OF SEMICONDUCTOR AND OPTO-ELECTRONIC MATERIALS ：APPLICATIONS   │ Lee, Ming-Hsien - Ajunct Professor(Physics Professor at Tamkang University)----HIGHLIGHT

English‧Asynchronous‧On line

Credit：0.5

This application course uses the most advanced theories and software available teach computational materials science. Graphical user interface with powerful atomistic model building, 3D visualization allow quick access to materials design tasks. Many kinds of physical properties can be analyzed. This course help students to bring closer the gap between fundamental physics and modern industrial applications.