NCKU 先進封裝中心

Advanced Packaging Technology Research Center

About the Center / 中心介紹

國立成功大學先進封裝研究中心致力於成為跨領域技術創新與產學研合作的領航者，以推動台灣半導體技術突破與永續發展為目標。我們專注於異質整合、先進製造、3D IC封裝及AI應用，結合校內九大學院資源，打造國際化研究平台，促進技術轉移與商品化應用。同時，中心積極培育具國際視野與實務能力的半導體高階人才，並推動綠色封裝技術，助力低碳經濟與永續未來。

The Advanced Packaging Research Center at National Cheng Kung University positions itself as a leader in interdisciplinary innovation and academia-industry collaboration, driving breakthroughs and sustainable development in Taiwan's semiconductor industry. Focusing on heterogeneous integration, advanced manufacturing, 3D IC packaging, and AI applications, we leverage resources from nine colleges to create an international research platform that facilitates technology transfer and commercialization. Additionally, the center actively nurtures semiconductor professionals with global perspectives and practical expertise while advancing green packaging technologies to support a low-carbon economy and a sustainable future.

中心營運核心│Core Values

01.跨領域整合｜ Interdisciplinary Integration

聯結九大學院研究力量，匯聚半導體製造、材料科學、人工智慧等領域專業知識，形成多學科交互創新的研究生態系統。

Connecting the research strengths of nine colleges, the center brings together expertise in semiconductor manufacturing, materials science, and artificial intelligence, fostering a multidisciplinary ecosystem of innovation.

02.產學協同創新｜Academia-Industry Collaborative Innovation

與半導體企業、研究機構及政府單位密切合作，識別業界技術需求並制定解決方案，促進技術開發和市場需求的高效對接。

Collaborating closely with semiconductor companies, research institutes, and government agencies, the center identifies industry needs and develops solutions to efficiently bridge technology development with market demands.

03.資源共享平台化 | Resource Sharing and Platformization

整合校內外實驗設備、數據資源及專業知識，打造開放性實驗平台，降低技術開發成本，提升設備和資源使用效率。
Integrating experimental facilities, data resources, and expertise within and beyond the university, the center creates an open experimental platform that reduces development costs and enhances the efficiency of equipment and resource utilization.

業務範圍｜Scope of Services

前沿技術研發 | Cutting-Edge Technology Development

聚焦3D IC封裝、異質整合技術、晶圓級封裝等關鍵領域，結合AI和大數據技術開展深度研究。

Focusing on critical areas such as 3D IC packaging, heterogeneous integration, and wafer-level packaging, the center conducts advanced research by integrating AI and big data technologies.

產學合作推動 | Academia-Industry Collaboration

建立靈活合作機制，設計定制化研究專案，促進技術轉移和商品化，提升產業價值鏈。

Establishing flexible collaboration mechanisms, the center designs customized research projects to promote technology transfer and commercialization, enhancing the industry's value chain.

專業人才培育 | Professional Talent Development

開設相關課程與實務訓練計畫，培養兼具理論知識與實務能力的技術專家。

Offering specialized courses and practical training programs, the center nurtures technical experts with both theoretical knowledge and practical skills.

國際學術交流 | International Academic Exchange

參與國際學術研討會，建立國際合作關係，提升台灣在先進封裝技術領域的影響力。
Participating in international conferences and fostering global partnerships, the center aims to enhance Taiwan's influence in advanced packaging technology.

組織架構｜Organizational Structure

中心主任
蘇炎坤名譽講座教授｜Yan-Kuin Su

中心副主任
羅裕龍教授｜Yu-Lung Lo

中心執行長
許文東教授｜Wen-Dung-Hsu

技術研究群 | Research Groups

先進材料研究組 | Advanced Materials Research Group
本研究組聚焦於新型材料於先進封裝中的應用，涵蓋高效能封裝材料的開發、熱傳導性能改良及機械穩定性分析。研究成果將應用於提升封裝技術的可靠度與性能。
This group focuses on the application of novel materials in advanced packaging, including the development of high-performance materials, thermal conductivity enhancement, and mechanical stability analysis. The research aims to improve the reliability and performance of packaging technologies.

先進製造技術研究組 | Advanced Manufacturing Technology Research Group

本研究組致力於封裝製程的創新技術，包括高密度互連技術、微小元件封裝技術及高效生產製程。透過新技術的導入，提升封裝效率與產品質量。

This group focuses on innovative packaging processes, including high-density interconnect technology, micro-component packaging, and efficient production processes. By introducing new technologies, it enhances packaging efficiency and product quality.

異質接合技術研究組 | Heterogeneous Integration Technology Research Group

本研究組專注於異質材料接合技術，涵蓋2.5D/3D IC封裝、晶片堆疊技術及異質材料接合技術，為未來高效能運算與人工智慧應用提供解決方案。

This group specializes in heterogeneous material integration technologies, including 2.5D/3D IC packaging, chip stacking, and heterogeneous bonding techniques. It provides solutions for high-performance computing and AI applications.

熱管理與可靠度分析組 | Reliability Analysis Research Group

本研究組專注於探討封裝元件在不同環境條件下的壽命與可靠度，包括溫度循環測試、機械衝擊測試等。通過實驗與數值模擬，建立可靠度預測模型，並進行最佳化設計。

This group investigates the lifespan and reliability of packaging components under various environmental conditions, including thermal cycling and mechanical impact testing. Through experiments and numerical simulations, it develops reliability prediction models and performs design optimization.

AI應用組 | AI in Advanced Packaging Applications Research Group

本研究組結合人工智慧與機器學習技術，開發先進封裝中的設計與優化模型。透過AI技術，加速設計流程，並提升封裝結構在可靠度與效能上的表現。

This group integrates AI and machine learning technologies to develop design and optimization models for advanced packaging. Using AI, it accelerates design processes and enhances the reliability and performance of packaging structures.