114學年度第1學期全英文微學分非同步線上課程
Flexible Intensive Course │ English-taught │ Asynchronous online
NCKU AISSM has aimed to make the advanced knowledge of semiconductor technology and related areas available to the NCKU campus. A series of the Essentials of Semiconductor Technology will be rolled out in the upcoming fall semester of 2024. NCKU students from all levels are welcome to join. Please take a look at the courses information and follow the schedule of the course enrollment system to add these courses to your basket.
Courses List
| Course Title | Hours | Credit | Format | Lecturer | Program |
|---|---|---|---|---|---|
| 數位積體電路設計概論(I) Fundamentals of digital IC design (I) |
9 | 0.5 | Online | 郭致宏 Chih-Hung Kuo | IC Design |
| 計算機組織概論 Fundamentals of Computer |
9 | 0.5 | Online | 林英超 Ing-Chao Lin | IC Design |
| 半導體科技工程-元件物理與製程概論 Essentials of Semiconductor Engineering |
9 | 0.5 | Online | 陳貞夙 Jen-Sue Chen | Process Tech |
| 製程整合與元件量測 Process Integration and Device measurement |
9 | 0.5 | Online | 何青原 Ching-Yuan Ho | Packaging & Testing |
| 奈米材料與合成科技 Nanomaterial synthesis and techniques |
9 | 0.5 | Online | 許蘇文 Su-Wen Hsu | Key Materials |
| 數位攣生與IC封裝 Digital twin and IC packaging |
9 | 0.5 | In person | 游濟華 Chi-Hua Yu | Smart Manufacturing |
- Students may enroll via the course enrollment system. Updates will be on NCKU Moodle.
- Online learning is asynchronous (EXCEPT "Digital twin and IC packaging").
- Withdrawal procedures: Withdrawal procedures (opens in new tab)
Courses Description
▒ 數位積體電路設計概論(I) │ Fundamentals of digital IC design (I)
介紹基本數位邏輯系統設計概念：Introduction/ Boolean algebra/ Applications of Boolean algebra/ From Boolean to circuits/ Design of combinational circuits...
Fundamental concepts for the design of digital logic circuits: Introduction/ Boolean algebra/ Applications of Boolean algebra...
郭致宏 副教授 │ Assoc. Prof. Chih-Hung Kuo
PhD, Electrical Engineering, USC
Area: IC Design / Electrical Engineering
| Date | Time |
|---|---|
| 113-09-09 至 11-04 (Mon) | 14:00 - 15:00 |
▒ 數位攣生與IC封裝 │ Digital Twin and IC Packaging
★ This course is conducted in-person in Fall 2024.
隨著傳統電晶體間距面臨理論上的挑戰，先進封裝已被廣泛用作「超越摩爾」技術的有效推動力之一...
With traditional transistor pitch scaling facing fundamental challenges, advanced package has been widely used...
游濟華 副教授 │ Assoc. Prof. Chi-Hua Yu
PhD, Civil Engineering, NTU
Area: Smart Manufacturing
| Date | Time |
|---|---|
| 113-11-05 至 11-19 (Tue) | 14:00 - 17:00 |
