113學年度第1學期全英文微學分非同步線上課程
Flexible Intensive Course │ English-taught │ Asynchronous online
NCKU AISSM has aimed to make the advanced knowledge of semiconductor technology and related areas available to the NCKU campus. A series of the Essentials of Semiconductor Technology will be rolled out in the upcoming fall semester of 2024. NCKU students from all levels are welcome to join. Please take a look at the courses information and follow the schedule of the course enrollment system to add these courses to your basket.
▌Courses List
| Course Title | Hours | Credit | Format | Lecturer | Program |
|---|---|---|---|---|---|
| 數位積體電路設計概論(I) Fundamentals of digital IC design (I) |
9 | 0.5 | Online | 郭致宏 Chih-Hung Kuo |
IC Design |
| 計算機組織概論 Fundamentals of Computer |
9 | 0.5 | Online | 林英超 Ing-Chao Lin |
IC Design |
| 半導體科技工程-元件物理與製程概論 The Essentials of Semiconductor Engineering – Fundamentals of Device Physics and Fabrication |
9 | 0.5 | Online | 陳貞夙 Jen-Sue Chen |
Semiconductor Process Technology |
| 製程整合與元件量測 Process Integration and Device measurement |
9 | 0.5 | Online | 何青原 Ching-Yuan Ho |
Semiconductor Packaging and Testing |
| 奈米材料與合成科技 Nanomaterial synthesis and techniques |
9 | 0.5 | Online | 許蘇文 Su-Wen Hsu |
Key Materials |
| 數位攣生與IC封裝 Digital twin and IC packaging |
9 | 0.5 | In person (Fall 2024) | 游濟華 Chi-Hua Yu |
Smart and Sustainable Manufacturing |
- ★ Students may get enrolled to the course based on the schedule of the course enrollment system and take the course after the start date. Any updates about the course schedule will be announced on NCKU Moodle.
- ★ The online learning will be done asynchronously.(EXCEPT 「Digital twin and IC packaging」)
- ★ Asynchronous online courses are categorized as Flexible (Intensive time)Courses (Micro Courses). Please refer to the specification of the withdrawal procedures on the course enrollment webpage.https://reg-acad.ncku.edu.tw/p/412-1041-17043.php?Lang=en
▌Courses Description
▒ 數位積體電路設計概論(I)│Fundamentals of digital IC design (I)
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介紹基本數位邏輯系統設計概念：Introduction/ Boolean algebra/ Applications of Boolean algebra/ From Boolean to circuits/ Design of combinational circuits/ Multiplexers and decoders/ Registers and counters/ Analysis of sequential circuits/ Design of sequential circuits
Fundamental concepts for the design of digital logic circuits： Introduction/ Boolean algebra/ Applications of Boolean algebra/ From Boolean to circuits/ Design of combinational circuits/ Multiplexers and decoders/ Registers and counters/ Analysis of sequential circuits/ Design of sequential circuits |
郭致宏 副教授 │ Kuo, Chih-Hung - Associate Professor PhD, Electrical Engineering, University of Southern California Area: IC Design/ Electrical Engineering
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▒ 計算機組織概論│Fundamentals of Computer
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介紹計算計組織與架構概念：Introduction/ Instruction Set-1/ Instruction Set-2/ ALU/ Data Path Design-1/ Data Path Design-2/ Data Path Design-3/ Memory Hierarchy-1/ Memory Hierarchy-2
Fundamental concepts of computer organization and architecture： Introduction/ Instruction Set-1/ Instruction Set-2/ ALU/ Data Path Design-1/ Data Path Design-2/ Data Path Design-3/ Memory Hierarchy-1/ Memory Hierarchy-2 |
林英超 教授 │ Lin, Ing-Chao - Professor PhD, Computer and Information Technology, University of Pennsylvania Area: IC Design/ Electrical Engineering
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▒ 半導體科技工程-元件物理與製程概論│The essentials of semiconductor engineering- fundamentals of device physics and fabrication
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「半導體科技工程 – 元件物理與製程概論」課程涵括半導體特性、材料、元件和製程技術等半導體工程技術基本領域，並討論這些領域之協同相關性。
“The Essentials of Semiconductor Engineering – Fundamentals of Device Physics and Fabrication” is concerned with semiconductor properties, materials, devices, and manufacturing technology. It considers the fundamental fields of semiconductor technology and identifies synergistic interactions within various areas in one concise course. |
陳貞夙 特聘教授│ Chen, Jen-Sue - Distinguished Professor PhD, Materials Science, California Institute of Technology Area: Semiconductor Process Technology/Materials Science
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▒ 製程整合與元件量測│Process integration and device measurement
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本課程包含VLSI應用元件的物理特性的基礎知識。將介紹載子行為、PN接面、MOS電容和MOSFET。此外，還描述TFT I-V電性測量。
This course contains basic knowledge of physical characteristics for VLSI application. Carriers behavior, PN junction, MOS capacitor and MOSFET will be introduced. Besides, the I-V measurement of TFT curves will be described as well. |
何青原 教授│ Ho, Ching-Yuan - Professor PhD, Mechanical Engineering, National Tsing Hua University Area: Semiconductor Packaging and Testing/Mechanical Engineering
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▒ 奈米材料與合成科技│Nanomaterial synthesis and techniques
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奈米材料科學與技術涉及奈米結構或奈米材料的設計、製造和應用，以及對物理性質或現象與材料尺寸之間關係的基本理解。 它涉及奈米材料或結構，是一個新領域或新的科學領域。 與量子力學類似，在奈米尺度上，材料或結構可能具有新的物理性質或表現出新的物理現象。 奈米材料具有極其廣泛的潛在應用，從奈米級電子學和光學到奈米生物系統和奈米醫學。 本課程將涵蓋以下主題：1.介紹 2.奈米材料的表徵 3.奈米材料的特性 4.奈米材料的表面化學 5.奈米材料的合成 6.奈米材料的應用。
Nanomaterials Science and technology is concerned with the design, fabrication and application of nanostructures or nanomaterials, and the fundamental understanding of the relationships between physical properties or phenomena and material dimensions. It deals with materials or structures in nanometers and is a new field or a new scientific domain. Similar to quantum mechanics, on nanometer scale, materials or structures may possess new physical properties or exhibit new physical phenomena. Nanomaterials have an extremely broad range of potential applications from nanoscale electronics and optics, to nanobiological systems and nanomedicine. This course will cover the following topics:1.intoruction 2.characuerization of nanomaterials 3.charateristics of nanomaterials 4.surface chemistry of nanomaterials 5.synthesis of nanomaterials 6.application nanomaterials. |
許蘇文 副教授│Hsu, Su-Wen - Associate Professor PhD, Materials Science and Engineering, University of California, San Diego Area: Key Materials/Chemical Engineering
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▒ 數位攣生與IC封裝│Digital Twin and IC Packaging
This course is conducted in-person in Fall 2024.
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隨著傳統電晶體間距面臨理論上的挑戰，先進封裝已被廣泛用作“超越摩爾”技術的有效推動力之一。採用先進封裝使採用的技術有望幫助實現未來的 5G、HPC、AIOT 設備應用，將具有不同晶圓節點、晶圓尺寸等的各種功能晶片整合成到一個封裝單元中。為幫助聽眾了解先進封裝的優勢，我們將提供一系列差異化的封裝製程技術，包括關鍵技術趨勢、製程工藝挑戰、相應的製程方法、材料、模擬仿真工具解決方案等。
With traditional transistor pitch scaling facing fundamental challenges, advanced package has been widely used as one of the effective enablers for “More-than-Moore” technology. Adopting advanced package enables technologies adopting is poised to help enabling the future 5G, HPC, AIOT device applications to integrate a variety of functional dies with different wafer nodes, wafer sizes, and so on – into one packaged unit. In order to help the audience realize the advantages of advanced package, speakers will provide a range of differentiated packaging enabling technologies, including key technology trends, process challenges, corresponding Methodology, Material, Simulation tool enabling solutions, and so on. |
游濟華 副教授│ Yu, Chi-Hua - Associate Professor PhD, Civil Engineering, National Taiwan University Area: Smart & Sustainable Manufacturing/Engineering Science
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