NCKU
先進封裝中心
Advanced Packaging Technology Research Center
About the Center
中心介紹
國立成功大學先進封裝研究中心致力於成為跨領域技術創新與產學研合作的領航者，以推動台灣半導體技術突破與永續發展為目標。我們專注於異質整合、先進製造、3D IC封裝及AI應用，結合校內九大學院資源，打造國際化研究平台，促進技術轉移與商品化應用。同時，中心積極培育具國際視野與實務能力的半導體高階人才，並推動綠色封裝技術，助力低碳經濟與永續未來。
The Advanced Packaging Research Center at National Cheng Kung University positions itself as a leader in interdisciplinary innovation and academia-industry collaboration, driving breakthroughs and sustainable development in Taiwan's semiconductor industry. Focusing on heterogeneous integration, advanced manufacturing, 3D IC packaging, and AI applications, we leverage resources from nine colleges to create an international research platform that facilitates technology transfer and commercialization. Additionally, the center actively nurtures semiconductor professionals with global perspectives and practical expertise while advancing green packaging technologies to support a low-carbon economy and a sustainable future.
中心營運核心│Core Values
01
跨領域整合｜ Interdisciplinary Integration
聯結九大學院研究力量，匯聚半導體製造、材料科學、人工智慧等領域專業知識，形成多學科交互創新的研究生態系統。
Connecting the research strengths of nine colleges, the center brings together expertise in semiconductor manufacturing, materials science, and artificial intelligence, fostering a multidisciplinary ecosystem of innovation.
02
產學協同創新｜Academia-Industry Collaborative Innovation
Collaborating closely with semiconductor companies, research institutes, and government agencies, the center identifies industry needs and develops solutions to efficiently bridge technology development with market demands.
03
資源共享平台化 | Resource Sharing and Platformization
整合校內外實驗設備、數據資源及專業知識，打造開放性實驗平台，降低技術開發成本，提升設備和資源使用效率。
Integrating experimental facilities, data resources, and expertise within and beyond the university, the center creates an open experimental platform that reduces development costs and enhances the efficiency of equipment and resource utilization.
業務範圍｜Scope of Services
前沿技術研發 | Cutting-Edge Technology Development
產學合作推動 | Academia-Industry Collaboration
建立靈活合作機制，設計定制化研究專案，促進技術轉移和商品化，提升產業價值鏈。
Establishing flexible collaboration mechanisms, the center designs customized research projects to promote technology transfer and commercialization, enhancing the industry's value chain.
專業人才培育 | Professional Talent Development
開設相關課程與實務訓練計畫，培養兼具理論知識與實務能力的技術專家。
Offering specialized courses and practical training programs, the center nurtures technical experts with both theoretical knowledge and practical skills.
國際學術交流 | International Academic Exchange
參與國際學術研討會，建立國際合作關係，提升台灣在先進封裝技術領域的影響力。
Participating in international conferences and fostering global partnerships, the center aims to enhance Taiwan's influence in advanced packaging technology.
組織架構
Organizational Structure
中心人員簡介｜Center Staff Overview
中心主任:蘇炎坤 名譽講座教授｜Yan-Kuin Su
國際公認的半導體與光電權威，專長於先進封裝、化合物半導體、Micro LED等領域，具豐富學術與產業經驗。
中心副主任:羅裕龍 教授 ｜Yu-Lung Lo
專精於智慧雷射加工與材料技術，曾獲多項學術與產業殊榮，主持多項國科會重大計畫。中心副主任:水野潤 教授 ｜Jun Mizuno
在異質整合與電子封裝領域具卓越成就，積極推動國際技術合作，並於多項國際會議擔任重要職務。中心執行長:莊婉君 教授｜Wan-Chun Chuang
專長於晶圓級薄膜材料分析與先進封裝技術，與日月光等企業合作開展多項產學計畫。研究組簡介與主要成員
Research Group Overview and Key Members
技術研究群 | Research Groups
- 先進材料研究組 | Advanced Materials Research Group
- 劉禹辰 教授 (組長)：材料微結構設計、機器學習應用於材料科學。
- 林世剛 教授：電子構裝技術、鋰離子電池材料設計。
- 游聲盛 教授：高分子材料與綠色化學應用。
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可靠度分析研究組 | Reliability Analysis Research Group
本研究組專注於探討封裝元件在不同環境條件下的壽命與可靠度，包括溫度循環測試、機械衝擊測試等。通過實驗與數值模擬，建立可靠度預測模型，並進行最佳化設計。
This group investigates the lifespan and reliability of packaging components under various environmental conditions, including thermal cycling and mechanical impact testing. Through experiments and numerical simulations, it develops reliability prediction models and performs design optimization.
本研究組聚焦於新型材料於先進封裝中的應用，涵蓋高效能封裝材料的開發、熱傳導性能改良及機械穩定性分析。研究成果將應用於提升封裝技術的可靠度與性能。
This group focuses on the application of novel materials in advanced packaging, including the development of high-performance materials, thermal conductivity enhancement, and mechanical stability analysis. The research aims to improve the reliability and performance of packaging technologies.
許文東 教授 (組長)：奈米材料與分子動力學模擬。 莊婉君 教授：多物理耦合系統分析與封裝技術。 屈子正 教授：電子元件可靠度分析與破壞力學。 許舒涵 教授：半導體可靠度與機器學習應用。
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先進製造技術研究組 | Advanced Manufacturing Technology Research Group
本研究組致力於封裝製程的創新技術，包括高密度互連技術、微小元件封裝技術及高效生產製程。透過新技術的導入，提升封裝效率與產品質量。
This group focuses on innovative packaging processes, including high-density interconnect technology, micro-component packaging, and efficient production processes. By introducing new technologies, it enhances packaging efficiency and product quality.
洪嘉宏 教授 (組長)：雷射金屬積層製造與自動化技術。
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異質接合技術研究組 | Heterogeneous Integration Technology Research Group
本研究組專注於異質材料接合技術，涵蓋2.5D/3D IC封裝、晶片堆疊技術及異質材料接合技術，為未來高效能運算與人工智慧應用提供解決方案。
This group specializes in heterogeneous material integration technologies, including 2.5D/3D IC packaging, chip stacking, and heterogeneous bonding techniques. It provides solutions for high-performance computing and AI applications.
水野潤 教授 (組長)：3D IC封裝與微奈米製造技術。
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AI於先進封裝應用研究組 | AI in Advanced Packaging Applications Research Group
本研究組結合人工智慧與機器學習技術，開發先進封裝中的設計與優化模型。透過AI技術，加速設計流程，並提升封裝結構在可靠度與效能上的表現。
This group integrates AI and machine learning technologies to develop design and optimization models for advanced packaging. Using AI, it accelerates design processes and enhances the reliability and performance of packaging structures.
游濟華 教授 (組長)：人工智慧應用於材料設計與模擬。