Semiconductor packaging and testing is the key to manufacturing a fully functionalized and durable electronic device. Our program integrates the relevant courses offered at National Cheng Kung University, Taiwan and cooperates with the industry to achieve the goal of cultivating semiconductor packaging and testing professionals. The curriculum covers the three major areas: packaging processes, packaging and testing smart manufacturing, and packaging and testing materials. Industrial professionals are also hired to offer practical courses so that students have both academic foundations and practical experience. In terms of thesis research, it is implemented based on the concept of industry proposition and academic problem-solving. Graduates from this program are expected to have a higher priority in recruitment in related industries after graduation.